Laser Circuit Board Cutting Machine 【SA/SF Series】
Non-contact laser circuit board cutting machine capable of substrate division.
The Laser Substrate Cutting Machine SA/SF series is a laser substrate cutting machine that enables processing without applying stress to the base material, thereby minimizing the generation of foreign substances. It can accurately cut FR4 substrates and flexible substrates, eliminating concerns about foreign substance generation and stress on the base material that were present in conventional processes. It can be equipped with lasers suitable for the material being processed, such as nanosecond lasers and picosecond lasers. We offer models in batch type and inline type. It is suitable for cutting individual pieces before and after mounting.
- Company：イープロニクス
- Price：Other
